Wafers are transported between stages in the EFEM and cleaning module. In the grinding module, the wafers move from rough grinding to finish grinding as the index table rotates. To improve the ...
JTEKT Toyoda Americas recently demonstrated a new double-disc horizontal grinder – calling it “an industry first” – that simultaneously grinds both sides of silicon wafers to +/- 1 micron from ...
The shift from planar SoCs to 3D-ICs and advanced packages requires much thinner wafers in order to improve performance and reduce power, reducing the distance that signals need to travel and the ...
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