“A long battery life is a first-class design objective for mobile devices, and main memory accounts for a major portion of total energy consumption. Moreover, the energy consumption from memory is ...

Samsung Electronics and SK hynix are accelerating the development of next-generation three-dimensional (3D) dynamic random-access memory (DRAM), with both companies aiming to complete and test early ...

Traditional DRAM technology, with memory bit cells consisting of one silicon transistor and one capacitor, faces major scaling challenges. A new DRAM bit cell without a capacitor and with two ...

Scratch-pad memory (SPM) has been widely used in embedded systems because it allows software-controlled data placement. By designing data placement strategies, optimal solutions with minimal memory ...

NEO Semiconductor announced on April 23rd that its 3D X-DRAM technology has successfully passed proof-of-concept (POC) validation, demonstrating that a new class of high-density DRAM can be ...

Dynamic random-access memory (DRAM) chips contain many other transistors besides the access transistor to enable full operation of the DRAM memory. These peripheral transistors must meet stringent ...

A new technical paper titled “New Tools, Programming Models, and System Support for Processing-in-Memory Architectures” was published by researchers at ETH Zurich. “Our goal in this dissertation is to ...

DRAM means cheap, standardized memory. We need lots of DRAM to feed our faster processors and ever-expanding network infrastructure and devices. Unfortunately, cheap memory usually means a standard ...